Editorial Board

Editor-in-Chief:


Sanghyuk Lee

Professor,
Xi'an Jiaotong-Liverpool University, China
 

 



Associate Editors-in-Chief:

Ka Lok Man, XJTLU, China

Gyusoo Chae, Baekseok University, Korea

Scott Uk-Jin Lee, Hanyang University, Korea

Seon Phil Jeong, United International College, China  

  



Editors:

Bing YANG, Central south university, China

Wei-li CHENG, Taiyuan University of Technology, China

Kiseok CHOI, NTIS Division, KISTI, Korea

Lvxiang DENG, Central South University, China

Yin-feng DOU, Heilongjiang University, China

Yunbin HE, Central South University, China

Kyung-Won HWANG, Dong-A University, Korea

Hai-Ning LIANG, The University of Western Ontario, Canada

Zhong-ping QUE, Taiyuan University of Technology, China

Cheng-jian RAN, Heilongjiang University, China

Fa-guang WANG, China University of mining and technology, China

Te XU, Northeastern University, China

Woon Seung YEO, KAIST, Korea

Hyeon-min Shim, Inha University, Korea

Yan Sun, XJTLU, China

Eng Gee LIM, XJTLU, China

Mohamed NAYEL, Assiut University, Egypt

Tomas Krilavi Äius, Baltic Institute of Advanced Technologies, Vytautas Magnus University, Lithuania

Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine

Paolo Prinetto, Politecnico di Torino, Italy

Massimo Poncino, Politecnico di Torino, Italy

Alberto Macii, Politecnico di Torino, Italy

Michel Schellekens, University College Cork, Ireland

Emanuel Popovici, University College Cork, Ireland

Umberto Rossi, STMicroelectronics, Italy

Franco Fummi, University of Verona, Italy

Graziano Pravadelli, University of Verona, Italy

Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong

Ajay Patel, Intelligent Support Ltd, United Kingdom

Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, Netherlands

Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA

Monica Donno, Minteos, Italy

Gregory Provan, University College Cork, Ireland

Miroslav N. Velev, Aries Design Automation, USA

M. Nasir Uddin, Lakehead University, Canada

Dragan Bosnacki, Eindhoven University of Technology, Netherlands

Milan Pastrnak, Siemens IT Solutions and Services, Slovakia

John Herbert, University College Cork, Ireland

Zhe-Ming Lu, Sun Yat-Sen University, China

Oscar Valero, University of Balearic Islands, Spain

Damien Woods, University of Seville, Spain

Franck Vedrine, CEA LIST, France

Bruno Monsuez, ENSTA, France

Kang Yen, Florida International University, USA

Takenobu Matsuura, Tokai University, Japan

R. Timothy Edwards, MultiGiG, Inc., USA

Olga Tveretina, Karlsruhe University, Germany

Maria Helena Fino, Universidade Nova De Lisboa, Portugal

Adrian Patrick O'Riordan, University College Cork, Ireland

Grzegorz Labiak, University of Zielona Gora, Poland

Jian Chang, Texas Instruments, Inc, USA

Anna Derezinska, Warsaw University of Technology, Poland

D.P. Vasudevan, University College Cork, Ireland

Arkadiusz Bukowiec, University of Zielona Gora, Poland

Jin Song Dong, National University of Singapore, Singapore

Dhamin Al-Khalili, Royal Military College of Canada, Canada

Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia

Steven Hollands, Synopsys, Ireland

Felipe Klein, State University of Campinas (UNICAMP), Brazil

Kevin Lee, Murdoch University, Australia

Prabhat Mahanti, University of New Brunswick, Saint John, Canada

Masahiro Sasaki, University of Tokyo, Japan

J.P.M. Voeten, Eindhoven University of Technology, Netherlands

Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA

Kevin Marquet, Verimag Laboratory, France

Matthieu Moy, Verimag Laboratory, France

Ramy Iskander, LIP6 Laboratory, France

Brian Logan, University of Nottingham, UK

Shin-Ya Takahasi, Fukuoka University, Japan

Cheng C. Liu, University of Wisconsin at Stout, USA

Farhan Siddiqui, Walden University, Minneapolis, USA

Katsumi Wasaki, Shinshu University, Japan

Pankaj Gupta, Microsoft Corporation, USA

Masoud Daneshtalab, University of Turku, Finland

Abhilash Goyal, Oracle (SunMicrosystems), USA

Boguslaw Cyganek, AGH University of Science and Technology, Poland

Yeo Kiat Seng, Nanyang Technological University, Singapore

Xuan Guan, Freescale Semiconductor, Austin, TX, USA

Ausra Vidugiriene, Vytautas Magnus University, Lithuania